Electron Source: Schottky FEG
- Landing Voltage: 50V to 30kV
- 0.7 nm resolution at optimal conditions
Ion Source: Xe ion plasma
- Landing Voltage: 2kV to 30kV
- <25 nm resolution at coincident point
Detectors (type):
- SEM ETD (secondary e-’s)
- SEM TLD (secondary or backscattered)
- STEM-III (bright field/dark field transmitted)
- ICE (secondary electron/ion)
- EDAX Velocity EBSD camera for (3D)EBSD mapping
- Edax Octane EDS detector for (3D)EDS mapping
Gas Delivery: MultiChem integrated system
- Currently C, Pt, W gas units installed
- Capable of gas mixtures to uniquely tailor depositions
EasyLift nanomanipulator for integrated chunk and lamella lift
NavCam+ for easier sample location/navigation
Vacuum transfer system for processing of samples directly from glovebox environments without exposure to atmosphere
Applications/Software
- Rocking mill feature for easy reduction in curtaining artifacts
- IFast Developers Kit for automated routines
- Auto Slice&View and EBS3/EDS3 for automated serial sectioning/chemical mapping
- AutoTEM for automated preparation of TEM lamellae
- MAPS for large area imaging/stitching